PCBuilder Picometre 14.5W/m.k Thermal Paste 2g

Description

The PCBuilder Picometre 14.5W/m.k Thermal Paste is an ideal choice for PC builders and tech enthusiasts seeking exceptional cooling performance. This premium thermal paste is designed to enhance heat transfer between your CPU or GPU and cooler, ensuring your system stays cool even during the most demanding tasks. With outstanding thermal conductivity (14.5W/m.k) and ultra-low resistance (<0.095℃-in²/W), it delivers rapid heat transfer for next-level cooling performance.

Engineered for a balanced density (viscosity of 95000±2000mPa, specific gravity of 2.8), this thermal paste allows for smooth, precise application every time. Its formula is optimized for easy spreading, ensuring a consistent layer that fills microscopic gaps for maximum contact. Perfect for both building and maintaining PCs, this heatsink compound makes thermal paste application simple and mess-free.

Built to withstand extreme conditions, the Picometre thermal paste can handle operating temperatures from -50°C to 280°C, making it ideal for high-performance systems and overclocking. Its durable silicone-based formula combines 85% metal oxides, providing a long-lasting seal that resists drying, cracking, or degrading. As a non-conductive paste, it offers complete peace of mind, eliminating any risk of short-circuiting sensitive components.

To apply the Picometre 14.5W/m.k Thermal Paste, clean the contact surfaces of your CPU or GPU and heatsink, then add a small, even amount to the centre of the component. Secure the heatsink to spread the paste evenly, resulting in close and optimised heat transfer. This straightforward thermal paste application ensures maximum cooling efficiency and extends your components’s lifespan.

Upgrade your system with the PCBuilder Picometre 14.5W/m.k Thermal Paste and experience the difference in cooling performance. Whether you’re gaming, editing, or simply looking to maintain your PC, this premium heatsink compound is a trusted choice for top-tier thermal efficiency. This thermal paste gives you cooling you can count on when your system is pushed to the limit.

FEATURES:

Perfect for PC building or maintenance, boost your cooling performance
Exceptional cooling efficiency with 14.5W/m.k thermal conductivity
Rapid heat transfers with minimal <0.095 resistance
Balanced density for smooth and controlled application
Easily handles temperatures up to 280°C
Durable silicone-based formula with metal oxides
Non-conductive of electricity for total peace of mind

SPECIFICATIONS:

Model: PCB-G2G14
Thermal conductivity: 14.5W/m.k
Thermal impedance: <0.095 ℃-in²/W
Viscosity: 95000±2000mPa
Vdaf (200°C/24h): <0.5%
Specific gravity: 2.8
Components:
- Silicones (polydimethylsiloxane) 15%
- Metal oxides (zinc oxide & aluminium oxide) 85%
Operating temperature: -50° to 280℃
Colour: Grey
Product dimensions: 11 x 2 x 2 cm
Product Weight: 2g