PCBuilder Micrometre 8.5W/m.k Thermal Paste 2g

Description

The PCBuilder Micrometre 8.5W/m.k Thermal Paste is your go-to solution for maximizing cooling performance in PC builds and upgrades. Thermal paste is essential for ensuring efficient heat transfer between your CPU or GPU and its heatsink. By filling microscopic gaps, it allows for seamless contact and dramatically improves heat transfers, keeping your system cool even under heavy loads. With incredible thermal conductivity of (8.5W/m.k) and low thermal resistance (<0.135℃-in²/W), this thermal paste delivers effortless cooling efficiency.

Crafted for reliability, this heatsink compound features a balanced density (viscosity of 75000±2000mPa, specific gravity of 2.6), making thermal paste application a breeze. Its smooth consistency ensures even and controlled spreading, eliminating the risk of messy or uneven layers. Designed to withstand temperatures ranging from -50°C to 200°C, this thermal paste is built to perform under extreme conditions, whether you’re overclocking or running demanding applications.

The durable silicone-based formula, enriched with 80% metal oxides, guarantees long-lasting performance without drying or cracking over time. As a non-electrically conductive heatsink compound, it also offers peace of mind by preventing short circuits, ensuring peace of mind when applied closely to your delicate PC components. This makes the Micrometre 8.5W/m.k Thermal Paste ideal for CPUs, GPUs, and other critical hardware in need of effective cooling.

Applying this thermal paste is straightforward. Clean the surfaces of your CPU or GPU and heatsink thoroughly, then add a small amount of the paste to the centre of the component. Once you secure the cooler, the paste will spread evenly, creating a perfect thermal seal. This simple thermal paste application ensures your system operates at peak performance without overheating.

Upgrade your PC with the Micrometre 8.5W/m.k Thermal Paste today. Its high thermal conductivity, ease of application, and reliable formulation make it the perfect choice for any builder or enthusiast looking to enhance their system’s cooling efficiency.

FEATURES:

Perfect for PC building or maintenance, boost your cooling performance
Elevated cooling efficiency with 8.5W/m.k thermal conductivity
Fast heat transfers with minimal <0.135 resistance
Balanced density for smooth and controlled application
Easily handles temperatures up to 200°C

SPECIFICATIONS:

Model: PCB-G2G8
Thermal conductivity: 8.5W/m.k
Thermal impedance: <0.135 ℃-in²/W
Viscosity: 75000±2000mPa
Vdaf (200°C/24h): <0.6%
Specific gravity: 2.6
Components:
- Silicones (polydimethylsiloxane) 20%
- Metal oxides (zinc oxide & aluminium oxide) 80%
Operating temperature: -50° to 200℃
Colour: Grey
Product dimensions: 11 x 2 x 2 cm
Product Weight: 2g